When creating production programs on placement machines, approximately 80% (Note 1) of the work is related to creating vision processing data. Creating data for package parts with multiple leads and bumps is a very difficult and time-consuming task. If vision processing data is not properly set, it can cause losses such as misalignment and machine stoppage due to part recognition errors, so this work is extremely important for ensuring quality.
Management of nozzles is vital for placement quality control, as they directly contact electrical parts. With increased product variations due to diversified customers' needs, the manufacturing industry is accelerating customization. This has resulted in an increase in the quantity and types of nozzles used for part handling. On top of that, the recent trend of miniaturization of electrical parts requires more time and effort to handle and maintain nozzles.
5G operations are now in full swing all around the world, and production of 5G base stations is proceeding at a rapid pace. Stability and improvements in processing capability are sought from 5G base stations and servers so that large data loads can be processed without delay. The electronic panels and electronic parts used in data processing are becoming larger and heavier in order to support the high-speed processing of large volumes of data and higher performance, and the SMT process must be able to respond to these changes. Here we will introduce placement solutions that are necessary for the production of 5G base station and server boards.
As market needs diversify, manufacturing sites are required to realize mass customization that realizes QCD at the same level as mass production. However, in the field of multi-product production, which frequently changes models, the decrease in production efficiency due to the increase in the number of setup changes is a major issue.
There is continued demand for the electronic devices we use, such as smartphones and wearable devices, to keep getting smaller while sustaining higher functionality. Also, with the proliferation of the Internet of Things we have reached the point in which communication modules and sensors are now commonplace in our home appliances and cars. This in turn has led to growth in demand for system in package (SiP) and other module parts. A common theme in the production processes for SiP and other module parts is the intertwining of cutting-edge placement technologies such as those for higher density placements, thinner structures, and multilayering.
There are times when an operator may set the wrong part type or set parts in the incorrect supply direction when supplying parts to the machine. For example, when setting trays to a tray drawer there can be cases in which the incorrect parts are set or the supply direction may be wrong such as when a tray is set in the wrong direction or if someone has returned parts that have come out back into the tray by hand.
Flexible printed circuits (FPC) are very thin with properties that allow them to be bent to a desired angle for use in electronics with movable parts and interfolded structures, and in three-dimensional wiring in devices with small interior spaces such as smartphones and wearables.
5G operations are in full swing all around the world. Production of 5G base stations is rapidly proceeding. Stability and improvements in processing capability are sought from 5G base stations and servers so that large data loads can be processed without delay. The electronic panels and parts used in data processing are becoming larger and heavier in order to support the high-speed processing of large volumes of data and higher performance. SMT process must be able to respond to these changes.